阿普(pu)奇無(wu)(wu)人(ren)售貨(huo)手(shou)動叉車抑制器TAC-3000是(shi)一款專為無(wu)(wu)人(ren)叉應(ying)用(yong)(yong)而設計(ji)的(de)(de)(de)(de)(de)高(gao)性能(neng)AI控(kong)制器。TAC-3000采用(yong)(yong)NVIDIA Jetson TMS O-DIMM連(lian)接(jie)(jie)器核(he)心板(ban)(ban),支(zhi)(zhi)持(chi)高(gao)性能(neng)的(de)(de)(de)(de)(de)AI計(ji)算(suan),最高(gao)可(ke)達(da)100TOPS算(suan)力(li)。能(neng)夠(gou)滿(man)足(zu)機(ji)器人(ren)應(ying)用(yong)(yong)中對(dui)強(qiang)大計(ji)算(suan)能(neng)力(li)的(de)(de)(de)(de)(de)需(xu)求(qiu)的(de)(de)(de)(de)(de)一起以(yi)確(que)(que)保高(gao)一級能(neng)效和低(di)耗電量(liang)。同(tong)意板(ban)(ban)載3個(ge)千(qian)兆(zhao)網絡接(jie)(jie)口和4個(ge)USB3.0接(jie)(jie)口,提供高(gao)速穩定(ding)的(de)(de)(de)(de)(de)網絡連(lian)接(jie)(jie)和數據(ju)傳輸能(neng)力(li)。適(shi)(shi)配(pei)多(duo)種(zhong)(zhong)不同(tong)初(chu)始化能(neng)力(li),還包括待選的(de)(de)(de)(de)(de)16位DIO、2個(ge)RS232/RS485可(ke)配(pei)置COM接(jie)(jie)口等,靈活配(pei)置外部(bu)設備連(lian)接(jie)(jie)。同(tong)一適(shi)(shi)用(yong)(yong)5G/4G/WiFi功(gong)能(neng)擴展,提供穩定(ding)的(de)(de)(de)(de)(de)無(wu)(wu)線通信(xin)連(lian)接(jie)(jie),確(que)(que)保機(ji)器人(ren)在不同(tong)環(huan)境下都能(neng)夠(gou)保持(chi)通信(xin)暢(chang)通。支(zhi)(zhi)持(chi)DC 12~28V寬(kuan)壓輸入(ru),適(shi)(shi)應(ying)不同(tong)的(de)(de)(de)(de)(de)電源環(huan)境。采用(yong)(yong)無(wu)(wu)風扇超緊湊設計(ji),全金屬高(gao)強(qiang)度機(ji)身,能(neng)夠(gou)適(shi)(shi)應(ying)各(ge)種(zhong)(zhong)惡劣的(de)(de)(de)(de)(de)環(huan)境條件,可(ke)使調節器要(yao)連(lian)接(jie)(jie)在種(zhong)(zhong)種(zhong)(zhong)狹窄的(de)(de)(de)(de)(de)空間內。的(de)(de)(de)(de)(de)同(tong)時(shi),TAC-3000還支(zhi)(zhi)持(chi)桌面(mian)式和DIN安裝方式,可(ke)根據(ju)實(shi)際應(ying)用(yong)(yong)需(xu)求(qiu)進(jin)行安裝部(bu)署。
上述(shu)講(jiang)到(dao)闡明,阿普奇(qi)無(wu)人(ren)機手動叉車(che)調整器TAC-3000憑借(jie)其強大的AI算力、高速網(wang)絡連接、豐富的I/O接口和卓越的擴展(zhan)性能,為(wei)無(wu)人(ren)叉車(che)應用提供了穩定、高效的支持。
Model | TAC-3000 | ||||
Processor System | SOM | Nano | TX2 NX | Xavier NX | Xavier NX 16GB |
AI Performance | 472 GFLOPS | 1.33 TFLOPS | 21 TOPS | ||
GPU | 128-core NVIDIA Maxwell??architecture GPU | 256-core NVIDIA Pascal??architecture GPU | 384-core NVIDIA Volta??architecture GPU with 48 Tensor Cores | ||
GPU Max Frequency | 921MHz | 1.3 GHz | 1100 MHz | ||
CPU | Quad-core?ARM??Cortex?-A57?MPCore processor | Dual-core?NVIDIA DenverTM?2?64-bit?CPU
and?quad-core?Arm??Cortex?-A57 MPCore processor |
6-core NVIDIA Carmel Arm? v8.2 64-bit CPU
?6MB L2 + 4MB L3 |
||
CPU Max Frequency | 1.43GHz | Denver 2: 2 GHz
Cortex-A57: 2 GHz |
1.9 GHz | ||
Memory | 4GB?64-bit?LPDDR4 25.6GB/s | 4GB?128-bit?LPDDR4 51.2GB/s | 8GB?128-bit?LPDDR4x 59.7GB/s | 16GB?128-bit?LPDDR4x 59.7GB/s | |
TDP | 5W-10W | 7.5W - 15W | 10W - 20W | ||
Processor System | SOM | Orin Nano 4GB | Orin Nano 8GB | Orin NX 8GB | Orin NX 16GB |
AI Performance | 20 TOPS | 40 TOPS | 70 TOPS | 100 TOPS | |
GPU | 512-core NVIDIA Ampere architecture GPU with 16 Tensor Cores | 1024-core NVIDIA Ampere architecture GPU
with 32 Tensor Cores |
1024-core NVIDIA Ampere architecture GPU
with 32 Tensor Cores |
||
GPU Max Frequency | 625 MHz | 765 MHz | 918 MHz | ? | |
CPU | 6-core Arm??Cortex??A78AE v8.2 64-bit CPU
1.5MB L2 + 4MB L3 |
6-core Arm??Cortex??A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 | 8-core Arm??Cortex??A78AE v8.2 64-bit CPU?2MB L2 + 4MB L3 | ||
CPU Max Frequency | 1.5 GHz | 2 GHz | |||
Memory | 4GB 64-bit LPDDR5 34 GB/s | 8GB 128-bit LPDDR5 68 GB/s | 8GB 128-bit LPDDR5 102.4 GB/s | 16GB 128-bit LPDDR5 102.4 GB/s | |
TDP | 7W - 10W | 7W - 15W | 10W - 20W | 10W - 25W | |
Ethernet | Controller | 1 * GBE LAN Chip (LAN signal from System-on-Module), 10/100/1000 Mbps
2 * Intel??I210-AT, 10/100/1000 Mbps |
|||
Storage | eMMC | 16GB eMMC 5.1 (Orin Nano and Orin NX SOMs do not support eMMC) | |||
M.2 | 1 * M.2 Key-M (NVMe SSD, 2280) (Orin Nano and Orin NX SOMs is PCIe x4 signal, while other SOMs is PCIe x1 signal) | ||||
TF Slot | 1 * TF Card Slot (Orin Nano and Orin NX SOMs do not support TF Card) | ||||
Expansion
Slots |
Mini PCIe | 1 * Mini PCIe Slot (PCIe x1+USB 2.0, with 1 * Nano SIM Card) (Nano SOM do not have PCIe x1 signal) | |||
M.2 | 1 * M.2 Key-B Slot (USB 3.0, with 1 * Nano SIM Card, 3052) | ||||
Front I/O | Ethernet | 2 * RJ45 | |||
USB | 4 * USB3.0 (Type-A) | ||||
Display | 1 * HDMI: Resolution up to 4K @ 60Hz | ||||
Button | 1 * Power Button + Power LED 1 * System Reset Button |
||||
Side I/O | USB | 1 * USB 2.0 (Micro USB, OTG) | |||
Button | 1 * Recovery Button | ||||
Antenna | 4 * Antenna hole | ||||
SIM | 2 * Nano SIM | ||||
Internal I/O | Serial | 2 * RS232/RS485 (COM1/2, wafer, Jumper Switch)
1 * RS232/TTL (COM3, wafer, Jumper Switch) |
|||
PWRBT | 1 * Power Button (wafer) | ||||
PWRLED | 1 * Power LED (wafer) | ||||
Audio | 1 * Audio (Line-Out + MIC, wafer)
1 * Amplifier, 3-W (per channel) into a 4-Ω Loads (wafer) |
||||
GPIO | 1 * 16 bits DIO (8xDI and 8xDO, wafer) | ||||
CAN Bus | 1 * CAN (wafer) | ||||
FAN | 1 * CPU FAN (wafer) | ||||
Power Supply | Type | DC, AT | |||
Power Input Voltage | 12~28V DC | ||||
Connector | Terminal block, 2Pin, P=5.00/5.08 | ||||
RTC Battery | CR2032 Coin Cell | ||||
OS Support | Linux | Nano/TX2 NX/Xavier NX: JetPack 4.6.3
Orin Nano/Orin NX: JetPack 5.3.1 |
|||
Mechanical | Enclosure Material | Radiator: Aluminum alloy, Box: SGCC | |||
Dimensions | 150.7mm(L) * 144.5mm(W) * 45mm(H) | ||||
Mounting | Desktop、DIN-rail | ||||
Environment | Heat Dissipation System | Fan less design | |||
Operating Temperature | -20~60℃?with 0.7 m/s airflow | ||||
Storage Temperature | -40~80℃ | ||||
Relative Humidity | 10 to 95% (non-condensing) | ||||
Vibration | 3Grms@5~500Hz, random, 1hr/axis (IEC 60068-2-64) | ||||
Shock | 10G, half sine, 11ms (IEC 60068-2-27) |
326--------m.svt516.com
265--------m.respectful-living.com
454--------m.totallyterroir.com
776--------m.488498.com
769--------m.htdgslb.com